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[For Semiconductors] CA20: High-Speed X-ray CT Inspection

Non-destructive high-speed inspection of micron-sized details!

In the semiconductor industry, defect detection in the manufacturing process is essential to ensure product quality and reliability. Particularly as miniaturization progresses, even slight abnormalities in internal structures can significantly impact product performance. The CA20 addresses the challenges of 3D ICs in semiconductor packaging and enables rapid defect detection. This contributes to improved yield and shortened development periods. 【 Application Scenarios 】 ■ Internal structure inspection of semiconductor packages ■ Defect detection in solder joints ■ Inspection of wafer-level packaging (WLP) 【 Benefits of Implementation 】 ■ Quality assurance of products through non-destructive testing ■ Cost reduction through early detection of defective products ■ Shortening of development cycles